Method for forming capacitor electrode

Abstract

A method for forming a capacitor electrode in accordance with the exemplary embodiment of the present disclosure includes preparing a substrate, forming a first thin film containing titanium (Ti) by injecting a source containing titanium on the substrate, and forming a second thin film by injecting a source containing a noble metal element or copper (Cu) on the substrate. Accordingly, in accordance with exemplary embodiments of the present disclosure, it is possible to suppress or prevent damage to an underlayer during electrode formation. In addition, it is possible to lower the resistivity of the electrode, and there is an effect of improving electrical characteristics of the electrode. In addition, there is an effect of improving quality characteristics of a capacitor as damage to the underlayer is suppressed or prevented and the electrical characteristics of the electrode are improved.

Dependencies are inferred from the claim text.