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H10N 70/861

Thermal details

Official title: {Thermal details}

H10N70/861 (Thermal details) appears on 697 US grants and 847 published applications in this corpus.

Search patents in H10N

Granted patents: 697
Published applications: 847
Assignees: 154
Inventors: 1,006
Latest grant: 6 Oct 2026

Filings by year

H10N 70/861: granted patents and published applications per publication year
Year	Granted patents	Published applications
1999	1	0
2000	0	0
2001	1	1
2002	1	1
2003	3	10
2004	6	8
2005	5	9
2006	6	25
2007	10	39
2008	17	31
2009	17	37
2010	45	28
2011	33	26
2012	29	25
2013	31	36
2014	32	35
2015	37	30
2016	34	45
2017	37	34
2018	32	30
2019	29	26
2020	79	97
2021	39	34
2022	26	40
2023	31	60
2024	31	62
2025	52	46
2026	33	32

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Subgroups

Granted patents

Recent patents

Electrostatic discharge path for preventing plasma-induced damage during patterning of phase change material and method for forming the same6 Oct 2026US 12,757,643 B2Taiwan Semiconductor Manufacturing Company.Ltd
Semiconductor device with phase-change material and method for manufacturing thereof6 Oct 2026US 12,757,644 B2Taiwan Semiconductor Manufacturing Company.Ltd
Phase change memory cell sidewall heater15 Sep 2026US 12,740,334 B2International Business Machines Corporation
Phase change material switch with reduced insertion loss and methods for forming the same15 Sep 2026US 12,740,335 B2Taiwan Semiconductor Manufacturing Company.Ltd
Structure and fabrication of PCM-based capacitor bank15 Sep 2026US 12,740,343 B2Taiwan Semiconductor Manufacturing Comany, Ltd.

Most cited

By later US patents