H10H 29/011
Of integrated devices comprising at least one light-emitting semiconductor component covered by
Official title: {of integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00}
H10H29/011 (Of integrated devices comprising at least one light-emitting semiconductor component covered by) appears on 29 US grants and 118 published applications in this corpus.
Search patents in H10H- Granted patents
- 29
- Published applications
- 118
- Assignees
- 60
- Inventors
- 303
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 2 |
| 2022 | 2 | 4 |
| 2023 | 2 | 12 |
| 2024 | 2 | 7 |
| 2025 | 7 | 42 |
| 2026 | 11 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Light emitting element and production method therefor29 Sep 2026US 12,751,128 B2Toyoda Gosei Co., Ltd.
- Integrated photodiode manufacturing method, a photodiode, and a photoelectric keyboard15 Sep 2026US 12,740,215 B2Shenzhen Huasheng Optoelectronics Co., Ltd.
- Light-emitting device and light-emitting module16 Jun 2026US 12,660,403 B2Nichia Corporation
- Method of manufacturing optoelectronic devices2 Jun 2026US 12,648,261 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Light emitting device and method of manufacturing the same19 May 2026US 12,635,294 B2Samsung Electronics Co., Ltd.
- Manufacturing method of a led array precursor with electrical contacts on same side, corresponding precursor, led array and devices comprising the same8 Oct 2026US 2026/0314139 A1Polar Light Technologies AB
- Full-color micro-led chip, display device, and manufacturing method1 Oct 2026US 2026/0305032 A1
- Method for manufacturing polychrome devices and polychrome display device1 Oct 2026US 2026/0305048 A1Micledi Microdisplays BV
- Method for producing an optoelectronic component, and optoelectronic component17 Sep 2026US 2026/0282625 A1ams-OSRAM International GmbH
- Vertically stacked red-green-blue full-color chip-on-carrier for microled display panels and method of manufacturing the same17 Sep 2026US 2026/0282626 A1Wavelord Co., Ltd
Most cited
By later US patents
- Method of fabricating multicolor light displays utilizing etch and refill techniques7US 4,012,243 AMotorola, Inc. · 1977
- LED sidewall processing to mitigate non-radiative recombination3US 10,418,519 B2Apple Inc. · 2019
- LED sidewall processing to mitigate non-radiative recombination2US 10,923,626 B22021
- Protection layer for a light emitting diode2US 11,411,146 B2Lumileds LLC · 2022