Integrated photodiode manufacturing method, a photodiode, and a photoelectric keyboard

Abstract

The present invention discloses an integrated photodiode manufacturing method, a photodiode, and a photoelectric keyboard; the said method comprises the provision of a parallel support, and there is a plurality of pins on the said parallel support; on the parallel support, the infrared light chip and the visible light chip are fixed and installed; the electrodes of the said infrared chip and the said visible light chip are connected to the corresponding said pins respectively to form the electrical circuits independently with each other; the said infrared light chip and the said visible light chip are packaged with the packaging adhesive and/or the fluorescent adhesive to form the photodiode. The said packaging adhesive is transparent or translucent adhesive, and the said fluorescent adhesive is photoluminescence fluorescent material adaptable to the color of the said visible light chip; the packaged photodiode is baked and cured to form the photodiode integrating infrared light and visible light. By the present method, a kind of photodiode emitting infrared light and visible light simultaneously can be manufactured. In application, the present integrated photodiode can reduce the amount of components and reduce the cost.

Dependencies are inferred from the claim text.