H10D 62/8164
Comprising only semiconductor materials
Official title: {comprising only semiconductor materials (potential variation in long-range structurally-disordered materials H10D62/8163)}
H10D62/8164 (Comprising only semiconductor materials) appears on 615 US grants and 593 published applications in this corpus.
Search patents in H10D- Granted patents
- 615
- Published applications
- 593
- Assignees
- 242
- Inventors
- 1,111
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 12 | 0 |
| 1988 | 7 | 0 |
| 1989 | 15 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 3 |
| 2002 | 11 | 11 |
| 2003 | 9 | 10 |
| 2004 | 10 | 32 |
| 2005 | 23 | 39 |
| 2006 | 19 | 27 |
| 2007 | 13 | 15 |
| 2008 | 14 | 13 |
| 2009 | 22 | 9 |
| 2010 | 11 | 11 |
| 2011 | 10 | 16 |
| 2012 | 14 | 14 |
| 2013 | 13 | 28 |
| 2014 | 24 | 35 |
| 2015 | 30 | 36 |
| 2016 | 35 | 44 |
| 2017 | 43 | 38 |
| 2018 | 34 | 23 |
| 2019 | 28 | 26 |
| 2020 | 25 | 23 |
| 2021 | 10 | 17 |
| 2022 | 12 | 21 |
| 2023 | 12 | 30 |
| 2024 | 26 | 28 |
| 2025 | 23 | 21 |
| 2026 | 11 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- III-N semiconductor structure and method of manufacturing same14 Jul 2026US 12,684,843 B2IVWorks Co., Ltd.
- Semiconductor structures9 Jun 2026US 12,652,839 B2Vanguard International Semiconductor Corporation
- Methods of formation of a SiGe/Si superlattice9 Jun 2026US 12,652,840 B2APPLIED Materials.Inc.
- Gallium nitride superjunction transistor19 May 2026US 12,635,158 B2Analog Devices, Inc.
- Nitride semiconductor with multiple nitride regions of different impurity concentrations, wafer, semiconductor device and method for manufacturing the same12 May 2026US 12,628,397 B2Kabushiki Kaisha Toshiba
- High-quality e-mode gan hemt power semiconductor epitaxial wafer using si(100) growth substrate8 Oct 2026US 2026/0313942 A1Wavelord Co., Ltd
- Radiation hardened (rad-hard) devices including superlattice to control boron doping profile and related methods24 Sep 2026US 2026/0293251 A1Atomera Incorporated
- Group iii-n devices with buffer structures and methods of manufacturing the same3 Sep 2026US 2026/0262241 A1
- Buried-channel semiconductor heterostructures with enhanced band offset3 Sep 2026US 2026/0262270 A1Technische Universiteit Delft
- Group iii-n devices with buffer structures and methods of manufacturing the same3 Sep 2026US 2026/0262271 A1
Most cited
By later US patents
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011
- Field effect devices having short period superlattice structures using Si and Ge261US 5,357,119 AThe Board of Regents of the University of California · 1994
- Gallium nitride materials and methods249US 6,617,060 B2Nitronex Corporation · 2003
- Semiconductor components, in particular photodetectors, light emitting diodes, optical modulators and waveguides with multilayer structures grown on silicon substrates219US 6,403,975 B1Max-Planck Gesellschaft zur Forderung der WissenschafteneeV · 2002
- Release strategies for making transferable semiconductor structures, devices and device components208US 8,895,406 B2The Board of Trustees of the University of Illinois · 2014