H05K 2203/162
Testing a finished product
Official title: Testing a finished product, e.g. heat cycle testing of solder joints
H05K2203/162 (Testing a finished product) appears on 359 US grants and 456 published applications in this corpus.
Search patents in H05K- Granted patents
- 359
- Published applications
- 456
- Assignees
- 250
- Inventors
- 875
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 3 |
| 2002 | 3 | 4 |
| 2003 | 6 | 10 |
| 2004 | 6 | 18 |
| 2005 | 7 | 16 |
| 2006 | 10 | 22 |
| 2007 | 22 | 18 |
| 2008 | 6 | 21 |
| 2009 | 9 | 13 |
| 2010 | 12 | 24 |
| 2011 | 12 | 18 |
| 2012 | 14 | 18 |
| 2013 | 19 | 9 |
| 2014 | 13 | 15 |
| 2015 | 14 | 18 |
| 2016 | 12 | 9 |
| 2017 | 13 | 11 |
| 2018 | 11 | 10 |
| 2019 | 15 | 20 |
| 2020 | 12 | 17 |
| 2021 | 16 | 20 |
| 2022 | 16 | 12 |
| 2023 | 11 | 11 |
| 2024 | 12 | 8 |
| 2025 | 8 | 14 |
| 2026 | 3 | 97 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder joint inspection features21 Jul 2026US 12,690,138 B2Kollmorgen Corporation
- Interposer board side wall having electrical features24 Mar 2026US 12,588,137 B1Snap Inc.
- Test device capable of testing micro LED and manufacturing method thereof10 Feb 2026US 12,546,812 B2Point Engineering Co., Ltd.
- Probe card device25 Nov 2025US 12,480,973 B2Princo Corp.
- Easy-to-assemble large-current composite circuit board and manufacturing process therefor7 Oct 2025US 12,439,510 B1
- Method for measuring peel strength of metal-bonded ceramic substrate, method for manufacturing metal-bonded ceramic substrate, and metal bonded ceramic substrate manufactured thereby20 Aug 2026US 2026/0243657 A1Amogreentech Co., Ltd.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
- Local-Bias Adaptive Drive for Timing Stabilization in Pipelined Mixed-Precision Processing Elements16 Jul 2026US 2026/0203017 A1
Most cited
By later US patents
- Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules125US 5,468,655 AMotorola, Inc. · 1995
- Surface mount technology evaluation board having varied board pad characteristics100US 6,888,360 B1Research In Motion Limited · 2005
- Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device84US 5,828,128 AFujitsu Limited · 1998
- Laminated board for testing electronic components69US 4,978,914 AFurukawa Denki Kogyo Kabushiki Kaisha · 1990
- Method for printed circuit board and/or printed wiring board cleaning68US 4,640,719 APetroleum Fermentations N.V. · 1987