Interposer board side wall having electrical features
AssigneeSnap Inc.
InventorsEdmilson Besseler, Shu-Fong Tsau
Life of this patent
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Abstract
A stacked printed circuit board assembly (PCBA) including an interposer board extending between a two circuit boards. The interposer board has a side wall including pads that are electrically tied to vias extending between electronic components of the circuit boards to allow testing of the electronic components and connections to any other electronic system. The test pads increase the number of probing points of the PCBA. Electrical traces electrically interconnect the test pads to the electronic components and may include electrical traces extending laterally through the interposer boards.
Claims20
A printed circuit board assembly (PCBA), comprising:
- a first circuit board having first electronic components;
- a second circuit board having second electronic components;
- and
- an interposer board disposed between the first and second circuit boards and having a plurality of vias, each via extending within the interposer board and electrically coupling one of the first electronic components with a corresponding one of the second electronic components, wherein the interposer board has a side wall extending between the circuit boards and having a plurality of test pads, each of the test pads electrically coupled to a corresponding one of the plurality of vias.
A method of testing a printed circuit board assembly (PCBA) having a first circuit board having first electronic components, a second circuit board having second electronic components, and an interposer board disposed between the first circuit board and the second circuit board and having a plurality of vias, each via extending within the interposer board and electrically coupling one of the first electronic components with a corresponding one of the second electronic components, wherein the interposer board has a side wall extending between the circuit boards and having a plurality of test pads each electrically coupled to a corresponding one of the plurality of vias, the method comprising:
- coupling a test probe to at least one of the test pads;
- and
- applying a test signal via the test probe to the at least one of the test pads and testing the electronic components.
A system, comprising:
- a printed circuit board assembly (PCBA), comprising:
- a first circuit board having first electronic components;
- a second circuit board having second electronic components;
- and
- an interposer board disposed between the first and second circuit boards and having a plurality of vias, each via extending within the interposer board and electrically coupling one of the first electronic components with a corresponding one of the second electronic components, wherein the interposer board has a side wall extending between the circuit boards and having a plurality of test pads each electrically coupled to one of the vias;
- and
- a testing fixture having a test probe coupled to at least one of the test pads and configured to apply a test signal via the test probe to the at least one of the test pads and test the electronic components.
Dependencies are inferred from the claim text.