Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device

A semiconductor device mountable to a wiring board, comprising:

• a package having a bottom surface which faces said wiring board when said semiconductor device is mounted on said wiring board;
• a first set of soldering bumps provided on said bottom surface of said package for making electrical contact with said wiring board;
• and
• a second set of soldering bumps provided on said bottom surface of said package for making electrical contact with said wiring board the second set of soldering bumps intentionally differing from the first set of soldering bumps in that the second set of soldering bumps has a different size than the first set of soldering bumps, the second set of soldering bumps being located at a position where the second set of soldering bumps is observable when said semiconductor device is mounted on said wiring board,
• said first set of soldering bumps having a regular size and said second set of soldering bumps being smaller than said first set of soldering bumps, said package having a conductive member electrically connected to said second set of soldering bumps, said conductive member being electrically connected to an external apparatus in a state where said semiconductor device is mounted on said wiring board.