H05K 2203/083
Evaporation or sublimation of a compound
Official title: Evaporation or sublimation of a compound, e.g. gas bubble generating agent
H05K2203/083 (Evaporation or sublimation of a compound) appears on 54 US grants and 55 published applications in this corpus.
Search patents in H05K- Granted patents
- 54
- Published applications
- 55
- Assignees
- 43
- Inventors
- 137
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 7 |
| 2005 | 0 | 3 |
| 2006 | 3 | 2 |
| 2007 | 2 | 3 |
| 2008 | 0 | 6 |
| 2009 | 4 | 8 |
| 2010 | 6 | 10 |
| 2011 | 3 | 1 |
| 2012 | 5 | 2 |
| 2013 | 2 | 1 |
| 2014 | 4 | 1 |
| 2015 | 2 | 3 |
| 2016 | 2 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 2 | 2 |
| 2024 | 1 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- Transferring viscous materials9 Sep 2025US 12,414,241 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Filtering cable12 Mar 2024US 11,929,189 B2
- Stretchable sensor and method of manufacturing the same and wearable device26 Dec 2023US 11,856,691 B2Samsung Electronics Co., Ltd.
- Increasing adhesion of metal-organic interfaces by silane vapor treatment14 Nov 2023US 11,818,849 B1Yield Engineering Systems, Inc.
- Wiring substrate8 May 2025US 2025/0151195 A1Ibiden Co., Ltd.
- Electronic device with improved interfacial adhesion of metal-organic interfaces24 Oct 2024US 2024/0357749 A1Yield Engineering Systems, Inc.
- Fabricating functional circuits on 3d freeform surfaces via intense pulsed light-induced zinc mass transfer15 Aug 2024US 2024/0276648 A1The Penn State Research Foundation
- Transferring viscous materials27 Jul 2023US 2023/0240017 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Pattern transfer of high viscosity material29 Jun 2023US 2023/0209722 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Low Dielectric constant materials for high speed electronics70US 5,576,517 AGeneral Electric Company · 1996
- Processing low dielectric constant materials for high speed electronics53US 5,449,427 AGeneral Electric Company · 1995
- Method and apparatus for CO.sub.2 cleaning with mitigated ESD38US 5,651,834 ALucent Technologies Inc. · 1997
- Processing low dielectric constant materials for high speed electronics29US 5,554,305 AGeneral Electric Company · 1996
- Forming plugs in vias of circuit board layers and subassemblies26US 6,282,782 B1Hadco Santa Clara, Inc. · 2001