Forming plugs in vias of circuit board layers and subassemblies
AssigneeHadco Santa Clara, Inc.
InventorsNicholas Biunno, Scott Bryan, Mason Hu
Life of this patent
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Abstract
A method of forming a subassembly for use in a printed circuit board is described. This method includes providing a subassembly including a circuit board layer laminated to two sheets of conductive material with two intermediate sheets of prepreg material, forming a via in the assembly, plating the via, filling the via with a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. Also described is a method of forming a partially filled via in a circuit board layer and a method of forming a thermally conductive plug in a circuit board layer for the transfer of thermal energy from one surface of the circuit board to the other.
Claims12
A method of forming a partially filled via in a circuit board layer comprising the steps of:
- (a) providing a circuit board layer, the circuit board layer having a first surface, a second surface, and defining a via;
- (b) filling a portion of the via with a non-conductive plug material in a volatile solvent;
- (c) evaporating the volatile solvent;
- and
- (d) curing the non-conductive plug material to form a partially filled via.
A circuit board layer comprising a partially filled via, the partially filled via having been formed by a method comprising the steps of:
- (a) providing a circuit board layer, the circuit board layer having a first surface, a second surface, and defining a via;
- (b) filling a portion of the via with a non-conductive plug material in a volatile solvent;
- (c) evaporating the volatile solvent;
- and
- (d) curing the non-conductive plug material to form a partially filled via.
Dependencies are inferred from the claim text.