Processing low dielectric constant materials for high speed electronics
AssigneeGeneral Electric Company
InventorsRobert J. Wojnarowski, Herbert S. Cole, Theresa A. Sitnik-Nieters, Wolfgang Daum
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Abstract
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
Claims14
A method for applying a porous low dielectric constant material over a substrate, comprising the steps of:
- dispersing an additive material in the porous low dielectric constant layer, so as to fill pores in the dielectric constant layer with said additive material;
- attaching the layer to a surface of the substrate;
- and
- removing the additive material from the layer.
Dependencies are inferred from the claim text.