Processing low dielectric constant materials for high speed electronics
AssigneeGeneral Electric Company
InventorsRobert J. Wojnarowski, Herbert S. Cole, Theresa A. Sitnik-Nieters, Wolfgang Daum
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Abstract
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
Claims5
A method for applying and ablating a low dielectric constant material over a substrate, comprising the steps of:
- attaching a low dielectric constant porous polymer layer to a surface of the substrate;
- applying mask material over the polymer layer;
- forming a via in the mask material extending through to the polymer layer;
- diffusing an additive material in a region of the polymer layer through the via in the mask material;
- removing the mask material;
- and
- ablating at least some of the polymer layer in the region where the additive material was diffused.
Dependencies are inferred from the claim text.