H05K 2203/0796
Oxidant in aqueous solution
Official title: Oxidant in aqueous solution, e.g. permanganate
H05K2203/0796 (Oxidant in aqueous solution) appears on 186 US grants and 138 published applications in this corpus.
Search patents in H05K- Granted patents
- 186
- Published applications
- 138
- Assignees
- 98
- Inventors
- 465
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 12 | 0 |
| 2001 | 10 | 3 |
| 2002 | 8 | 6 |
| 2003 | 12 | 12 |
| 2004 | 9 | 15 |
| 2005 | 5 | 13 |
| 2006 | 4 | 11 |
| 2007 | 4 | 6 |
| 2008 | 4 | 11 |
| 2009 | 3 | 13 |
| 2010 | 8 | 7 |
| 2011 | 1 | 1 |
| 2012 | 10 | 3 |
| 2013 | 6 | 6 |
| 2014 | 4 | 2 |
| 2015 | 4 | 4 |
| 2016 | 2 | 2 |
| 2017 | 1 | 4 |
| 2018 | 4 | 0 |
| 2019 | 0 | 3 |
| 2020 | 2 | 4 |
| 2021 | 2 | 1 |
| 2022 | 2 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 4 |
| 2025 | 1 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite copper components17 Jun 2025US 12,336,116 B2Namics Corporation
- Etch chemistry for metallic materials16 Jan 2024US 11,873,564 B2Hutchinson Technology Incorporated
- Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite27 Sep 2022US 11,453,823 B2InkTee Co., Ltd.
- Method for forming circuits using seed layer and etchant composition for selective etching of seed layer26 Apr 2022US 11,317,514 B2Inktec Co., Ltd.
- Method for repairing a fine line28 Dec 2021US 11,212,921 B2Guangdong University of Technology
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Wiring board and mounting structure using the wiring board18 Dec 2025US 2025/0386433 A1KYOCERA Corporation
- Method for cleaning a nonconductive surface and use16 Oct 2025US 2025/0324516 A1Atotech Deutschland GmbH
- Cleaning agent, cleaning method and supplementary liquid26 Jun 2025US 2025/0207069 A1Mec Company Ltd.
- Composite film, rigid flexible printed circuit board, and electronic device including same3 Apr 2025US 2025/0113442 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Adhesive for electroless plating, printed circuit boards and method of producing the same101US 5,055,321 AIbiden Co., Ltd. · 1991
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999
- Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions62US 4,425,380 AKollmorgen Technologies Corporation · 1984
- Copper coating of printed circuit boards61US 5,800,859 A1998