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AssigneeKollmorgen Technologies Corporation
InventorsFrancis J. Nuzzi, John K. Duffy
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An improved process for removing resin smeared on an interior wall of a hole in a resinous substrate and/or adhesion promoting the substrate which comprises: (a) contacting the substrate with an alkaline permanganate treating solution having a pH between about 11 and about 13 and an elevated temperature for a time period sufficient to remove the resin smear; (b) neutralizing essentially all manganese residue on the substrate; (c) contacting the substrate with an alkaline hydroxide etchant to remove the balance of manganese residue on the substrate. A metal such as copper subsequently may be electrolessly deposited in a more efficient and easily controlled manner on the resin substrate in the formation of a wire scribed circuit board or multilayer printed circuit board. In addition to resin smear removal, the process results in an improved bond between copper and the hole wall.
A process for preparing a resinous substrate for subsequent metallization which process comprises the following steps:
In a process for preparing a resinous substrate for subsequent metallization which process includes contacting said substrate with an alkaline permanganate treating solution for a time period sufficient to adhesion promote the surface;
In a process for metallizing a multilayer circuit board having at least three layers, a top, at least one intermediate, and a bottom layer, said intermediate layer being comprised of an insulating material and a metal conductor, said board having at least one hole, wherein resin is chemically removed from the interior wall of said hole by pretreatment, comprising the following steps:
In a process for metallizing the surface and holes of a multilayer circuit board having at least three layers, a top, at least one intermediate, and a bottom layer, said intermediate layer being comprised of an insulating material and a metal conductor, the circuit board having at least one hole formed therethrough, the interior wall of said hole having a resin smear thereon, wherein prior to said metallization, the board is subjected to pretreatment comprising the following steps:
In a process for electrolessly depositing metal onto a multilayer circuit board having at least three layers, a top, an intermediate, and a bottom layer, said intermediate layer being comprised of an insulating material and a metal conductor, the circuit board having at least one hole formed therethrough, the interior walls of said hole having a resin smear thereon, wherein prior to said electroless metal deposition, which includes the steps of activating the surface of the board by depositing thereon a solution containing a noble metal, and then electrolessly depositing a metal on the activated surface and holes of the board, the board is subjected to pretreatment comprising the following steps:
In a process for metallizing a discrete wire circuit board having at least one polyimide insulated wire affixed to a surface of or imbedded in a substrate and at least one hole through the wire and the board, the wire portion interior wall of the hole having exposed metal surfaces with resin smear thereon, the improvement which comprises:
In a process for metallizing a circuit board having at least one conductor imbedded therein and at least one hole in the board contacting the conductor, the conductor having a resin smear thereon, the process including treating the circuit board with an alkaline permanganate solution having a pH between about 11 and about 13 to remove said resin smear from the conductor contacting the hole, the improvement which comprises contacting the circuit board with an alkaline hydroxide solution at a temperature between about 40.degree. C. and about 95.degree. C. for a time period sufficient to remove manganese residues from the surface and holes of the circuit board, prior to said metallization.
In a process for metallizing a discrete wire circuit board having at least one insulated wire affixed to a surface of a substrate or imbedded therein and at least one hole in the board intersecting the wire, the wire having a resin smear thereon, the process including treating the circuit board with an alkaline permanganate solution having a pH between about 11 and about 13 to remove said resin smear from the wire intersecting the hole wall, the improvement which comprises contacting the circuit board with an alkaline hydroxide solution at a temperature between about 40.degree. C. and about 95.degree. C. for a time period sufficient to remove manganese residues from the surface and holes of the circuit board, prior to said metallization.
In a process for electrolessly depositing metal on a discrete wire circuit board having at least one insulated wire affixed to a surface of a substrate or imbedded therein and at least one hole through the wire and board, the interior wall of said hole having a resin smear thereon, wherein the interior wall of the hole and the intersected tip of the wire are metallized by electroless deposition, wherein said electroless metal deposition includes conditioning the surface of the circuit board to accept and hold a metal deposit by immersing the board in an alkaline permanganate treating solution, neutralizing permanganate on the board, activating the surface of the board by depositing thereon a solution containing a noble metal, and then electrolessly depositing a metal on the activated surface of the board, the improvement in said process which insures a good conductive joint between the tip of an intersected wire and the wall of a hole in the board intersecting the wire comprising:
A process for metallizing an insulating resinous substrate containing at least one internal metallic conductor and at least one hole wherein the surface of the substrate is prepared for adherent metal deposition and resin smear or resin residue is removed from the intersection of the conductor with the hole, comprising:
Dependencies are inferred from the claim text.