H05K 2203/0542
Continuous temporary metal layer over metal pattern
H05K2203/0542 (Continuous temporary metal layer over metal pattern) appears on 80 US grants and 73 published applications in this corpus.
Search patents in H05K- Granted patents
- 80
- Published applications
- 73
- Assignees
- 54
- Inventors
- 185
- Latest grant
- 25 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 3 |
| 2003 | 2 | 4 |
| 2004 | 3 | 6 |
| 2005 | 4 | 5 |
| 2006 | 3 | 11 |
| 2007 | 2 | 10 |
| 2008 | 7 | 8 |
| 2009 | 8 | 8 |
| 2010 | 1 | 4 |
| 2011 | 5 | 2 |
| 2012 | 5 | 3 |
| 2013 | 1 | 1 |
| 2014 | 2 | 0 |
| 2015 | 1 | 3 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods for forming engineered thermal paths of printed circuit boards by use of removable layers25 Mar 2025US 12,262,464 B2
- Circuit structure and fabrication method thereof29 Oct 2024US 12,133,337 B2Innolux Corporation
- Insulation structure for high temperature conditions and manufacturing method thereof5 Jan 2016US 9,231,167 B2Samsung Electronics Co., Ltd.
- Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)18 Aug 2015US 9,113,547 B2Intel Corporation
- Structure and method of making interconnect element, and multilayer wiring board including the interconnect element14 Oct 2014US 8,859,420 B2Invensas Corporation
- Circuit structure16 Jan 2025US 2025/0024608 A1Innolux Corporation
- Systems and methods for manufacturing printed circuit boards4 Jul 2024US 2024/0224430 A1
- Devices and methods for forming engineered thermal paths of printed circuit boards by use of removable layers9 Jun 2022US 2022/0183141 A1TTM Technologies, Inc.
- Circuit structure and fabrication method thereof23 Dec 2021US 2021/0400819 A1Innolux Corporation
- Printed circuit board21 May 2020US 2020/0163228 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method for manufacturing a probe133US 5,513,430 AMotorola, Inc. · 1996
- Stacked solid via formation in integrated circuit systems85US 5,055,425 AHewlett-Packard Company · 1991
- Stacked solid via formation in integrated circuit systems83US 5,162,260 AHewlett-Packard Company · 1992
- Interconnection element for electric circuits65US 8,299,368 B2Invensas Corporation · 2012
- Electrolytic method of depositing gold connectors on a printed circuit board63US 5,733,466 AInternational Business Machines Corporation · 1998