H05K 2203/0508
Flood exposure
H05K2203/0508 (Flood exposure) appears on 11 US grants and 10 published applications in this corpus.
Search patents in H05K- Granted patents
- 11
- Published applications
- 10
- Assignees
- 11
- Inventors
- 38
- Latest grant
- 13 May 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 3 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Photonic heating of silver grids13 May 2014US 8,722,322 B2Eastman Kodak Company
- Patterning a thick film paste in surface features30 Oct 2012US 8,298,034 B2E. I. Du Pont de Nemours and Company
- Process for making circuit board or lead frame28 Feb 2006US 7,005,241 B2Shinko Electric Industries Co., Ltd.
- Process for manufacturing a multi-layer circuit board21 May 2002US 6,391,210 B2International Business Machines Corporation
- Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby18 Sep 2001US 6,290,860 B1International Business Machines Corporation
- Copper particulate dispersion, conductive film forming method, and circuit board7 Jan 2016US 2016/0007455 A1Ishihara Chemical Co., Ltd.
- Photonic heating of silver grids1 Aug 2013US 2013/0196269 A1Eastman Kodak Company
- Circuit board with conductor post structure8 Dec 2011US 2011/0299259 A1
- Patterning a thick film paste in surface features16 Dec 2010US 2010/0314989 A1E. I. Du Pont de Nemours and Company
- Method of forming metal plate pattern and circuit board25 Jan 2007US 2007/0017090 A1
Most cited
By later US patents
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Method for the attachment of components to a circuit board using photoactuatable adhesive29US 4,916,805 AESPE Stiftung & Co. Produktions- und Vertriebs KG · 1990
- Laser etch-back process for forming a metal feature on a non-metal substrate26US 5,221,426 AMotorola, Inc. · 1993
- Method for photographically improving the resolution of screen printed photopolymer images14US 4,610,941 A1986
- Fabrication method of printed wiring board13US 5,464,662 ANEC Corporation · 1995