Method for the attachment of components to a circuit board using photoactuatable adhesive
AssigneeESPE Stiftung & Co. Produktions- und Vertriebs KG
InventorsKlaus Ellrich, Oswald Gasser, Rainer Guggenberger, Erich Wanek
Life of this patent
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Abstract
For the attachment of components using the SMT method a procedure is suggested in which the adhesive used is activated prior to fitting of the components to the circuit board by irradiation with light having a wavelength in the range of 200 to 600 nm to such an extent that the desired initial tackiness is maintained and there is no formation of skin on the surface of the adhesive. This makes it possible to cause the adhesive composition to fully cure in a shorter time and at lower temperature than has been possible so far without the wettability of the adhesive during the fitting of the components to the circuit board being impaired.
Claims14
A method for the attachment of components to a circuit board comprising applying a photoactivatable adhesive to selected areas of the components or of the circuit board, activating said adhesive prior to or after application thereof by irradiation with light having a wavelength in a range of 200 to 600 nm to such an extent that a desired initial tackiness is maintained and no skin formation on the surface of the adhesive takes place, subsequently fitting the components to the circuit board thereby establishing contact between said components, adhesive and circuit board, curing said adhesive at a temperature between 60.degree. and 140.degree. C. and subsequently producing soldered joints between the components and the circuit board.
Dependencies are inferred from the claim text.