Copper particulate dispersion, conductive film forming method, and circuit board
AssigneeIshihara Chemical Co., Ltd.
InventorsYuichi KAWATO, Hidetoshi ARIMURA, Tomio KUDO
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Abstract
Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a dispersion vehicle and copper particulates dispersed in the dispersion vehicle. The copper particulate dispersion contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates during the photo-sintering of the copper particulates.
Claims7
A copper particulate dispersion comprising a dispersion vehicle and copper particulates dispersed in the dispersion vehicle, characterized in that:
- the copper particulate dispersion contains a sintering promoter;
- and
- the sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature, and it is a compound that forms a complex with copper at a temperature higher than ambient temperature, and it is selected from the group consisting of polyamideimide, polyimide, phosphonic acid, β-diketone, acetylene glycol, thioether, and sulfate ester;
- and
- the temperature higher than ambient temperature is obtained by irradiation with light for photo-sintering the copper particulates.
A copper particulate dispersion comprising a dispersion vehicle and copper particulates dispersed in the dispersion vehicle, characterized in that:
- the copper particulate dispersion contains a sintering promoter;
- the sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature, and it is an alkali that dissolves copper oxide at a temperature higher than ambient temperature, and the alkali is potassium hydroxide;
- and
- the temperature higher than ambient temperature is obtained by irradiation with light for photo-sintering the copper particulates.
3-8. (canceled)
Dependencies are inferred from the claim text.