Circuit board with conductor post structure
OwnerYu-Ling Hsieh, I-Tseng Lee +3inventors
InventorsYu-Ling Hsieh, I-Tseng Lee, Yi-Hsiu Liu, Jen-Yi Tsai, Cheng-hua Fan
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Abstract
Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask.
Claims20
A method of manufacturing, comprising:
- forming a conductor post on a side of a circuit board, the conductor post including an end projecting away from the side of the circuit board;
- applying a solder mask to the side of the circuit board to cover the conductor post;
- and
- reducing a thickness of the solder mask so that a portion of the conductor post projects beyond the solder mask.
A method of manufacturing, comprising:
- forming plural conductor posts on a side of a semiconductor chip package substrate, each of the conductor posts including an end projecting away from the side of the circuit board;
- applying a solder mask to the side of the semiconductor chip package substrate to cover the plural conductor posts;
- and
- reducing a thickness of the solder mask so that a portion of each of the conductor posts projects beyond the solder mask.
An apparatus, comprising:
- a circuit board including a side;
- a solder mask coupled to the side of the circuit board;
- and
- a conductor post coupled to the side of the circuit board and including a first end projecting into the solder mask and a second end projecting out of the solder mask, wherein the second end is not wider than the first end.
Dependencies are inferred from the claim text.