H05K 2203/0143
Using a roller
Official title: Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
H05K2203/0143 (Using a roller) appears on 248 US grants and 309 published applications in this corpus.
Search patents in H05K- Granted patents
- 248
- Published applications
- 309
- Assignees
- 193
- Inventors
- 726
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 3 |
| 2002 | 2 | 8 |
| 2003 | 7 | 10 |
| 2004 | 4 | 15 |
| 2005 | 7 | 16 |
| 2006 | 8 | 25 |
| 2007 | 4 | 33 |
| 2008 | 5 | 17 |
| 2009 | 14 | 28 |
| 2010 | 13 | 16 |
| 2011 | 13 | 8 |
| 2012 | 9 | 14 |
| 2013 | 2 | 4 |
| 2014 | 15 | 11 |
| 2015 | 14 | 20 |
| 2016 | 8 | 12 |
| 2017 | 10 | 6 |
| 2018 | 8 | 11 |
| 2019 | 4 | 10 |
| 2020 | 11 | 10 |
| 2021 | 10 | 7 |
| 2022 | 5 | 5 |
| 2023 | 8 | 7 |
| 2024 | 5 | 6 |
| 2025 | 5 | 4 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Reel-to-reel circuit board manufacturing apparatus5 May 2026US 12,621,935 B2Haesung Ds Co., Ltd.
- Component carrier and method of manufacturing the same7 Apr 2026US 12,598,696 B2AT&S (Chongqing) Company Limited
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Mounting board manufacturing method and flux coating device7 Oct 2025US 12,439,527 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin laminate formation device and resin laminate formation method18 Jun 2026US 2026/0166873 A1Fuji Corporation
- Enhance isolation package7 May 2026US 2026/0129746 A1Analog Devices, Inc.
- Tape and manufacturing method thereof5 Mar 2026US 2026/0068058 A1Chipbond Technology Corporation
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
- Component Carrier and Method for Manufacturing a Component Carrier25 Sep 2025US 2025/0301575 A1AT&S (Chongqing) Company Limited
Most cited
By later US patents
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Electrical circuit component formed of a conductive liquid printed directly onto a substrate117US 5,763,058 AParamount Packaging Corporation · 1998
- Method for preventing distortions in a flexibly transferred feature pattern92US 6,655,286 B2Lucent Technologies Inc. · 2003
- Creating recessed regions in a substrate and assemblies having such recessed regions73US 7,542,301 B1Alien Technology Corporation · 2009
- Method and apparatus for solder bumping of printed circuit boards70US 4,752,027 AHewlett-Packard Company · 1988