Mounting board manufacturing method and flux coating device

Abstract

A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Dependencies are inferred from the claim text.