H05K 2201/10462
Flat component oriented parallel to the pcb surface
Official title: Flat component oriented parallel to the PCB surface
H05K2201/10462 (Flat component oriented parallel to the pcb surface) appears on 69 US grants and 69 published applications in this corpus.
Search patents in H05K- Granted patents
- 69
- Published applications
- 69
- Assignees
- 77
- Inventors
- 212
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 2 |
| 2003 | 2 | 0 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 2 | 2 |
| 2007 | 1 | 5 |
| 2008 | 2 | 9 |
| 2009 | 4 | 3 |
| 2010 | 5 | 5 |
| 2011 | 4 | 0 |
| 2012 | 3 | 4 |
| 2013 | 1 | 1 |
| 2014 | 1 | 3 |
| 2015 | 1 | 2 |
| 2016 | 1 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 0 |
| 2019 | 1 | 4 |
| 2020 | 0 | 1 |
| 2021 | 3 | 1 |
| 2022 | 2 | 3 |
| 2023 | 1 | 0 |
| 2024 | 3 | 2 |
| 2025 | 1 | 12 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic package module and method for fabrication of the same9 Jun 2026US 12,652,760 B2USI Science and Technology (Shenzhen) Co., Ltd.
- Wiring board5 May 2026US 12,621,928 B2KYOCERA Corporation
- Mounting assembly and circuit board assembly15 Jul 2025US 12,363,829 B2Adlink Technology Inc.
- Connection system for printed circuit board10 Sep 2024US 12,085,764 B2Senko Advanced Components, Inc.
- Power semiconductor component and method for producing a power semiconductor component9 Apr 2024US 11,955,402 B2Vitesco Technologies Gbmh
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Electronic device and metal heat dissipation9 Jul 2026US 2026/0197931 A1Wistron Neweb Corp.
- Heat dissipation module11 Dec 2025US 2025/0380352 A1ASUSTeK COMPUTER INC.
- Printed circuit board and electronic control device2 Oct 2025US 2025/0311086 A1Denso Corporation
Most cited
By later US patents
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems199US 6,011,741 ASanDisk Corporation · 2000
- Double-sided flexible electronic circuit module92US 4,567,543 AMotorola, Inc. · 1986
- Surface mount semiconductor device78US 5,635,760 ANEC Corporation · 1997
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems76US 6,947,332 B2SanDisk Corporation · 2005