Surface mount semiconductor device

A vertical mount type semiconductor device comprising:

• a package main body having two opposed and parallel major surfaces, and four side surfaces connected to said two major surfaces;
• a plurality of lead terminals extending from only one of said side surfaces of said package main body, each of said plurality of lead terminals having a first leg as it extends from said one side surface with said first leg being substantially parallel to said major surfaces, each of said plurality of lead terminals having a second leg being bent substantially perpendicular to said first leg, said second leg having a distal end, said distal end of said second leg extending a predetermined perpendicular distance from the plane of one of said major surfaces;
• and
• a projecting portion integral to said package main body and extending from said main body a distance being the same as the predetermined perpendicular distance said distal end of said second leg extends from said plane of said one major surface, and said projecting portion extends from said package main body in the same direction as the second leg extends from said first leg.

A horizontal mount type semiconductor device comprising:

• a package main body having two opposed and parallel major surfaces and four side surfaces respectively connected said major surfaces;
• a first side surface of said four side surfaces which includes a first section having a predetermined distance from one end of the first side surface, a second section having a predetermined distance from another end of the first side surface, and a third section interposed between the first and the second sections, with no lead terminal extending from the first and the second sections;
• a plurality of lead terminals extending from only the third section of said first side surface;
• and
• first and second projecting portions, each of said projecting portions being integrally formed on a first major surface of said major surfaces in the vicinity of a corner of said first major surface adjacent a second side surface from which no lead terminal extends, said second side surface being opposite said first side surface, and a distance between said first and second projecting portions being longer than the length of said third section of said first side surface.

A horizontal mount type semiconductor device comprising:

• a package main body having two opposed and parallel major surfaces and four side surfaces respectively connected to said major surfaces;
• a first side surface of said four side surfaces including a first section having a predetermined distance from one end of the first side surface, a second section having a predetermined distance from another end of the first side surface, and a third section interposed between the first and the second sections, with no lead terminal extending from the first and the second sections;
• a plurality of lead terminals extending from only the third section of said first side surface;
• a second side surface of said four side surfaces opposite to said first side surface and including a fourth section having a predetermined distance from one end of the second side surface, a fifth section having a predetermined distance from another end of the second side surface, and a sixth section interposed between the fourth and the fifth sections and having a longer length than the length of the third section, with no lead terminal extending from the sixth section;
• and
• a plurality of first and second support leads extending from the fourth and the fifth sections, respectively, of said second side surface.

A circuit board having mounted thereon a plurality of horizontal mount type semiconductor devices, the semiconductor devices comprising:

• a package main body having two opposed and parallel major surfaces and four side surfaces respectively connected to said major surfaces;
• a first side surface of said four side surfaces including a first section having a predetermined distance from one end of the first side surface, a second section having a predetermined distance from another end of the first side surface, and a third section interposed between the first and the second sections, with no lead terminal extending from the first and the second sections;
• a plurality of lead terminals extending from only the third section of said first side surface;
• a second side surface of said four side surfaces opposite to said first side surface and including a fourth section having a predetermined distance from one end of the second side surface, a fifth section having a predetermined distance from another end of the second side surface, and a sixth section interposed between the fourth and the fifth sections and having a longer length than the length of the third section, with no lead terminal extending from the sixth section;
• and
• a plurality of first and second support leads extending from the fourth and the fifth sections, respectively, of said second side surface;
• the plurality of semiconductor devices adjacent each other on the circuit board with the lead terminals of the third section contacting the circuit board and the first and second support leads of the fourth and fifth sections contacting the circuit board to provide support.