Heat dissipation module
AssigneeASUSTeK COMPUTER INC.
InventorsPo-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
Life of this patent
Estimating the term…
Loading patent…
AssigneeASUSTeK COMPUTER INC.
InventorsPo-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
Estimating the term…
A heat dissipation module is adapted to be installed on a motherboard having a connector. The connector is adapted to connect an interface card. The heat dissipation module includes a base assembly adapted to be fixed on the motherboard, a heat dissipation member, and a fastening member. The base assembly is an integrated base body having opposite first and second ends. The first end is adjacent to the connector and has a fixing portion. The second end has a fastening portion. The interface card is adapted to be installed between the first end and the second end. The heat dissipation member has opposite third and fourth ends. The third end is adapted to be detachably connected to the fixing portion. The fastening member is pivoted on the fourth end and adapted to be detachably connected to the fastening portion.
A heat dissipation module, adapted to be installed on a motherboard, wherein the motherboard has a connector, and the connector is adapted to connect an interface card, the heat dissipation module comprising:
A heat dissipation module, adapted to be installed on a motherboard, wherein the motherboard has a connector, and the connector is adapted to connect an interface card, the heat dissipation module comprising:
Dependencies are inferred from the claim text.