H05K 2201/10454
Vertically mounted
H05K2201/10454 (Vertically mounted) appears on 169 US grants and 127 published applications in this corpus.
Search patents in H05K- Granted patents
- 169
- Published applications
- 127
- Assignees
- 107
- Inventors
- 380
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 2 |
| 2002 | 6 | 7 |
| 2003 | 7 | 12 |
| 2004 | 8 | 4 |
| 2005 | 3 | 3 |
| 2006 | 9 | 9 |
| 2007 | 3 | 6 |
| 2008 | 0 | 6 |
| 2009 | 6 | 3 |
| 2010 | 2 | 3 |
| 2011 | 6 | 3 |
| 2012 | 2 | 2 |
| 2013 | 1 | 5 |
| 2014 | 4 | 12 |
| 2015 | 5 | 6 |
| 2016 | 5 | 1 |
| 2017 | 3 | 3 |
| 2018 | 5 | 4 |
| 2019 | 1 | 9 |
| 2020 | 6 | 4 |
| 2021 | 7 | 7 |
| 2022 | 4 | 2 |
| 2023 | 8 | 4 |
| 2024 | 4 | 3 |
| 2025 | 1 | 5 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic package module and method for fabrication of the same9 Jun 2026US 12,652,760 B2USI Science and Technology (Shenzhen) Co., Ltd.
- Electronic device7 Oct 2025US 12,438,292 B2Seiko Epson Corporation
- High speed network device with orthogonal pluggable optics modules3 Dec 2024US 12,158,627 B2Arista Networks, Inc.
- Connection system for printed circuit board10 Sep 2024US 12,085,764 B2Senko Advanced Components, Inc.
- Display device having light emitting diodes formed on the array substrate4 Jun 2024US 12,001,090 B2Japan Display Inc.
- High Speed Network Switch With Orthogonal Pluggable Optics Modules26 Feb 2026US 2026/0056379 A1Arista Networks, Inc.
- Microelectronic devices including embedded electronic components, and associated methods and systems29 Jan 2026US 2026/0032823 A1Micron Technology, Inc.
- Electronic unit4 Dec 2025US 2025/0374435 A1Nissan Motor Co., Ltd.
- Packaged electrical devices and related methods30 Oct 2025US 2025/0336575 A1
- Substrate with built-in electronic components14 Aug 2025US 2025/0261314 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Resin seal semiconductor package107US 5,656,863 AMitsubishi Denki Kabushiki Kaisha · 1997
- Semiconductor package having interlocking heat sinks and method of fabrication106US 6,075,288 AMicron Technology, Inc. · 2000
- Semiconductor device with surface mount package adapted for vertical mounting98US 5,451,815 AFujitsu Limited · 1995
- Vertical connector based packaging solution for integrated circuits84US 6,005,776 AIntel Corporation · 1999
- Internally shielded energy conditioner80US 7,675,729 B2X2Y Attenuators, LLC · 2010