Vertical connector based packaging solution for integrated circuits

An assembly comprising:

• a substrate;
• and
• a plurality of components connected to the substrate and packaged to be connected to the substrate in a vertical orientation, at least one of the plurality of components includes
• a vertical chip scale package including a plurality of connection leads,
• an integrated circuit die contained in the package and generally situated along a vertical plane,
• an interconnect capable of transferring information between the plurality of connection leads and the integrated circuit die, the interconnect includes a first segment generally perpendicular to the vertical plane and connected to the at least one connection lead and a second segment generally in parallel to the vertical plane and connected to the integrated circuit die, and
• a compliant material upon which the integrated circuit die is situated and around which the interconnect is routed.

An electronic system comprising:

• a chipset;
• and
• an assembly connected to the chipset, the assembly including
• a substrate;
• and
• a plurality of components connected to the substrate and packaged to be connected to the substrate in a vertical orientation, at least one of the plurality of components includes
• a vertical chip scale package including a plurality of connection leads,
• an integrated circuit die contained in the package and generally situated in a vertical plane,
• an interconnect capable of transferring information between the plurality of connection leads and the integrated circuit die, the interconnect includes a first segment generally perpendicular to the vertical plane and connected to the at least one connection lead and a second segment generally in parallel to the vertical plane and connected to the integrated circuit die, and
• a compliant material upon which the integrated circuit die is situated and around which the interconnect is routed.

An assembly comprising:

• a substrate;
• and
• a vertical memory module attached to the substrate, the vertical memory module including
• a plurality of components arranged in a vertical orientation, each of the plurality of components including:
• a compliant material,
• an integrated circuit die situated on the compliant material,
• a heat spreader adjacent to a first side of the integrated circuit die, and
• an interconnect coupled to the integrated circuit die and the substrate and routed around the compliant material, the interconnect including a first segment configured to be substantially in parallel with the integrated circuit die and a second segment configured to be substantially flush against the substrate;
• and
• an encapsulation material covering each integrated circuit die and interconnect of the plurality of components in their entirety and a substantial portion of each heat spreader of the plurality of components.