Resin seal semiconductor package

A resin seal semiconductor package, comprising:

• a semiconductor chip provided with an element;
• a bonding pad formed on said semiconductor chip;
• a base metal layer which is connected to said bonding pad, extending to a position shifted from said bonding pad in a direction of said main surface of said semiconductor chip and having a function as a barrier layer;
• a first conductor formed in a position on said base metal layer shifted from said bonding pad and having a substantially flat top surface;
• a seal resin sealing said semiconductor chip and exposing said top surface of said first conductor;
• and
• a lumpish second conductor being in contact with said top surface of said first conductor and made of a material different from that of said first conductor.

A resin seal semiconductor package, comprising:

• a semiconductor chip provided at its main surface with an element;
• first and second bonding pads formed on said main surface of said semiconductor chip;
• a conductive layer which extends from said first bonding pad to said second bonding pad for electrically connecting said first and second bonding pads;
• an electrode for external connection electrically connected to said conductive layer and making an electrical connection, which is located in a region on said semiconductor chip not bearing said first and second bonding pads, to an external equipment;
• and
• a seal resin sealing said semiconductor chip and exposing a portion of a surface of said electrode for external connection.

A semiconductor device including a resin seal semiconductor package, which is provided at its main surface with a plurality of protruded electrodes having partially exposed surfaces and is electrically connected to and mounted on a printed board, wherein

• said resin seal semiconductor package is mounted on said printed board with its main surface being upright to said printed board;
• said printed board has protruded connection electrodes at positions corresponding to said protruded electrodes of said resin seal semiconductor package;
• and
• said protruded electrodes of said resin seal semiconductor package and said connection electrodes on said printed board are melted and bonded together.

A resin seal semiconductor package comprising:

• first and second semiconductor chip each having a main surface and a rear surface and disposed with their rear surfaces being opposite each other;
• a first conductor formed on said main surfaces of said first and second semiconductor chips, respectively and forming portions of protruded electrodes for external connection;
• a seal resin exposing a portion of surface of said first conductor and integrally sealing said first and second semiconductor chips;
• and
• a second conductor formed on said portion of said first conductor and forming a portion of said electrodes for external connection.