Microelectronic devices including embedded electronic components, and associated methods and systems

A method of forming a microelectronic device, the method comprising:

• forming a substrate including an insulative material and a conductive structure embedded within the insulative material;
• forming a recess through a first surface of the substrate to expose at least a portion of the conductive structure;
• disposing an electronic component within the recess;
• coupling a first end of the electronic component to the conductive structure;
• and
• forming a conductive cap over a second end of the electronic component at the first surface of the substrate.

An electronic system comprising:

• an input device;
• an output device;
• a processor device operably coupled to the input device and the output device;
• and
• a memory device operably coupled to the processor device;
• at least one of the memory device and the processor device comprising a microelectronic device comprising:
• an insulative structure;
• a first solder mask over a first surface of the insulative structure;
• a second solder mask over a second surface of the insulative structure opposite the first surface;
• a first conductive surface structure between the first surface of the insulative structure and the first solder mask;
• a second conductive surface structure between the second surface of the insulative structure and the second solder mask;
• and
• a vertically oriented electronic component disposed within the insulative structure, the vertically oriented electronic component comprising a first terminal electrically coupled to the first conductive surface structure and a second terminal electrically coupled to the second conductive surface structure.