H05K 2201/10378
Interposers
H05K2201/10378 (Interposers) appears on 1,746 US grants and 1,839 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,746
- Published applications
- 1,839
- Assignees
- 520
- Inventors
- 3,653
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 19 | 0 |
| 1995 | 17 | 0 |
| 1996 | 23 | 0 |
| 1997 | 18 | 0 |
| 1998 | 36 | 0 |
| 1999 | 36 | 0 |
| 2000 | 32 | 0 |
| 2001 | 39 | 21 |
| 2002 | 51 | 49 |
| 2003 | 44 | 54 |
| 2004 | 39 | 68 |
| 2005 | 40 | 62 |
| 2006 | 57 | 72 |
| 2007 | 52 | 62 |
| 2008 | 43 | 87 |
| 2009 | 39 | 84 |
| 2010 | 54 | 55 |
| 2011 | 48 | 59 |
| 2012 | 51 | 51 |
| 2013 | 44 | 50 |
| 2014 | 44 | 67 |
| 2015 | 53 | 58 |
| 2016 | 65 | 73 |
| 2017 | 74 | 80 |
| 2018 | 72 | 94 |
| 2019 | 86 | 93 |
| 2020 | 96 | 114 |
| 2021 | 95 | 87 |
| 2022 | 64 | 105 |
| 2023 | 77 | 95 |
| 2024 | 58 | 94 |
| 2025 | 88 | 59 |
| 2026 | 51 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device comprising interposer printed circuit board22 Sep 2026US 12,745,349 B2Samsung Electronics Co., Ltd.
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- Power converter package with copper-bar thermally-enhanced interposers to cooling fins1 Sep 2026US 12,727,129 B2Hong Kong Applied Science and Technology Research Institute Company Limited
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Back side power delivery for wafer-scale integration with solderless modular power substrates25 Aug 2026US 12,721,191 B2Volantis Semiconductor, Inc.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Display device24 Sep 2026US 2026/0292991 A1Samsung Display Co., Ltd.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Component Carrier13 Aug 2026US 2026/0239534 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999