H05K 2201/10363
Jumpers, i.e. non-printed cross-over connections
H05K2201/10363 (Jumpers, i.e. non-printed cross-over connections) appears on 166 US grants and 167 published applications in this corpus.
Search patents in H05K- Granted patents
- 166
- Published applications
- 167
- Assignees
- 131
- Inventors
- 369
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 2 | 3 |
| 2005 | 2 | 4 |
| 2006 | 1 | 4 |
| 2007 | 4 | 4 |
| 2008 | 4 | 6 |
| 2009 | 3 | 9 |
| 2010 | 1 | 5 |
| 2011 | 2 | 3 |
| 2012 | 4 | 5 |
| 2013 | 5 | 8 |
| 2014 | 5 | 7 |
| 2015 | 7 | 9 |
| 2016 | 6 | 11 |
| 2017 | 12 | 7 |
| 2018 | 9 | 10 |
| 2019 | 14 | 13 |
| 2020 | 9 | 7 |
| 2021 | 5 | 12 |
| 2022 | 8 | 7 |
| 2023 | 5 | 12 |
| 2024 | 10 | 10 |
| 2025 | 9 | 6 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Jump-fusing and tailored PCB system for loop inductance reduction8 Sep 2026US 12,733,513 B2Texas Instruments Incorporated
- Jumper chip component14 Jul 2026US 12,683,038 B2Panasonic Intellectual Property Management Co., Ltd.
- Sensing device24 Mar 2026US 12,582,314 B2Advanced Semiconductor Engineering, Inc.
- Transmission cable structure3 Feb 2026US 12,543,266 B2Elka International Ltd.
- Circuit layout of printed circuit board27 Jan 2026US 12,538,418 B2Realtek Semiconductor Corp.
- Circuit board, circuit board assembly, and electronic device27 Aug 2026US 2026/0255480 A1Honor Device Co., Ltd.
- Sensing device23 Jul 2026US 2026/0207053 A1Advanced Semiconductor Engineering, Inc.
- Printed board, image forming apparatus, and mounting method12 Mar 2026US 2026/0072392 A1Canon Kabushiki Kaisha
- Junction block for distributing high-current power12 Mar 2026US 2026/0075722 A1Kyungshin Corp.
- Image forming apparatus25 Dec 2025US 2025/0390033 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Flexible substrate electronic assembly83US 5,276,418 AMotorola, Inc. · 1994
- Digital signal processing assembly and test method81US 6,181,004 B22001
- Wiring board and method for manufacturing the same60US 8,971,053 B2Ibiden Co., Ltd. · 2015
- Programmable header49US 4,471,158 AAdvanced Circuit Technology · 1984
- Electrically conductive wire37US 6,752,310 B2Koninklijke Philips Electronics N. V. · 2004