Printed board, image forming apparatus, and mounting method

A printed board comprising:

• a through hole arrangement in which a plurality of through holes including a first through hole, a second through hole and a third through hole are arranged adjacently in an arrangement direction;
• a plurality of lands disposed corresponding to the plurality of through holds, respectively, the plurality of lands including a first land corresponding to the first through hole, a second land corresponding to the second through hole, and a third land corresponding to the third through hole;
• and
• a component of which one end side is mounted on the second through hole and of which the other end side is mounted on the third through hole, and overlapped with the first through hole as seen in a direction perpendicular to a surface of the printed board.

A mounting method for mounting a mounting component on a substrate,

• wherein the mounting component is provided with a plurality of lead pins,
• wherein the substrate includes:
• a plurality of through hole including a first through hole and a second through hole;
• a plurality of lands disposed corresponding to the plurality of through holds, respectively;
• a first pad;
• a second pad;
• a third pad;
• and
• a fourth pad,
• wherein the plurality of lands includes:
• a first land to which one of lead pins, of the plurality of lead pins to be mounted on the first through hole, is soldered, the first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion;
• and
• a second land to which one of lead pins, of the plurality of lead pins to be mounted on the second through hole, is soldered, the second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion, and
• wherein the mounting method includes:
• a first step for inserting the plurality of lead pins into the plurality of through holes;
• a second step for soldering the plurality of lead pins on the plurality of lands;
• a third step for connecting an inspection device to the first pad and the second pad, and measuring a current signal;
• and
• a fourth step for connecting the inspection device to the third pad and the fourth pad, and measuring a current signal.