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US 12,582,314 B2Granted
Sensing device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKuei-Hao Tseng, Kai Hung Wang, Kai-Di Lu, Yu-Chih Lee, Cheng-Tsao Peng, Pang Yuan Lee
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Abstract
The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.
Claims20
A sensing device, comprising:
- a carrier;
- a first processor disposed over a first surface of the carrier and electrically connected with the carrier;
- an encapsulant disposed over the carrier and covering the first processor;
- an electrode disposed over the encapsulant and configured to detect a signal external to the sensing device, wherein a projection area of the electrode on the carrier is substantially equal to a projection area of the encapsulant on the carrier;
- and
- a plurality of flexible connectors form a radial pattern and diverge from the first processor from a top view, wherein each flexible connector of the plurality of flexible connectors includes two straight sides perpendicular to the first surface of the carrier, and a curved top connecting between the two straight sides, and wherein the curved tops of the plurality of flexible connectors are covered by the electrode;
- wherein the plurality of flexible connectors are configured to receive the signal from the electrode and transmit the signal to the carrier and further to the first processor.
4 more elements
Dependencies are inferred from the claim text.