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US 6,752,310 B2Granted
Electrically conductive wire
AssigneeKoninklijke Philips Electronics N.V.
InventorsEddy W. Vanhoutte, Gilbert De Clercq
Life of this patent
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Abstract
The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.
Claims2
A soldering method comprising:
- a. placing a solderable assembly on a substrate, the assembly comprising:
- i. an electrically conductive wire;
- ii a first solder ball fixed on said wire;
- iii. a second solder ball fixed on said wire, said second ball being distinct from said first ball;
- and
- iv. flux fixed on said wire, the flux separating said first and second solder balls, contacting both of said first and second solder balls and substantially filling a space between the first and second solder balls;
- said placing being such that an end of the electrically conductive wire protrudes through the substrate onto an opposite side from the first and second solder balls and the flux;
- and
- b. applying heat to the end to cause the first and second solder balls and the flux to melt on a single contact.
6 more elements
Dependencies are inferred from the claim text.