Circuit layout of printed circuit board

A circuit layout of a printed circuit board (PCB), the circuit layout comprising:

• a first routing including a first set of front-end transmission line(s), a first set of bonding pads, a first set of bridge pads, and a first set of back-end transmission line(s), wherein:
• the first set of front-end transmission line(s) is coupled with a transmission interface of a central processing unit (CPU) and coupled with the first set of bonding pads;
• the first set of bonding pads includes first bonding pads, wherein any two of the first bonding pads alone are separate;
• the first set of bridge pads includes first bridge pads, wherein any two of the first bridge pads alone are separate while any one of the first bridge pads and any one of the first bonding pads alone are separate;
• and when the circuit layout is used for a first purpose, the first set of back-end transmission line(s) is coupled with the first set of bonding pads and coupled with a transmission interface of a first module;
• a second routing including a second set of front-end transmission line(s), a second set of front-end pads, a second set of bridge pads, and a second set of transmission circuit(s), wherein:
• the second set of front-end transmission line(s) is coupled with the first set of bridge pads and coupled with the second set of front-end pads;
• the second set of front-end pads includes a plurality of second front-end bonding pads, wherein any two of the second front-end bonding pads alone are separate;
• the second set of bridge pads includes second bridge pads, wherein any two of the second bridge pads alone are separate while any one of the second bridge pads and any one of the second front-end bonding pads alone are separate;
• and when the circuit layout is used for a second purpose, the second set of transmission circuit(s) is coupled with the second set of bridge pads and coupled with a transmission interface of a second module;
• and at least one set of connection component(s), wherein:
• when the circuit layout is used for the first purpose, the at least one set of connection component(s) includes a first set of connection component(s), in which the first set of connection component(s) couples multiple bonding pads of the first bonding pads together and thereby electrically couples the first set of front-end transmission line(s) with the first set of back-end transmission line(s) so that the transmission interface of the CPU is electrically coupled with the transmission interface of the first module while the first set of bonding pads and the first set of bridge pads are electrically separate;
• and when the circuit layout is used for the second purpose, the at least one set of connection component(s) includes a second set of connection component(s) and a third set of connection component(s), in which the second set of connection component(s) couples the first set of bonding pads with the first set of bridge pads and thereby electrically couples the first set of front-end transmission line(s) with the second set of front-end transmission line(s), and the third set of connection component(s) couples the second set of front-end pads with the second set of bridge pads and thereby electrically couples the second set of front-end transmission line(s) with the second set of transmission circuit(s) so that the transmission interface of the CPU is electrically coupled with the transmission interface of the second module while any two of the first bonding pads are electrically separate.