H05K 2201/10303
Pin-in-hole mounted pins
H05K2201/10303 (Pin-in-hole mounted pins) appears on 580 US grants and 533 published applications in this corpus.
Search patents in H05K- Granted patents
- 580
- Published applications
- 533
- Assignees
- 410
- Inventors
- 1,509
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 10 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 3 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 2 |
| 2002 | 9 | 13 |
| 2003 | 10 | 11 |
| 2004 | 16 | 12 |
| 2005 | 12 | 16 |
| 2006 | 14 | 12 |
| 2007 | 10 | 13 |
| 2008 | 6 | 27 |
| 2009 | 7 | 23 |
| 2010 | 12 | 17 |
| 2011 | 17 | 21 |
| 2012 | 12 | 15 |
| 2013 | 15 | 25 |
| 2014 | 11 | 21 |
| 2015 | 17 | 23 |
| 2016 | 19 | 30 |
| 2017 | 22 | 21 |
| 2018 | 32 | 26 |
| 2019 | 21 | 26 |
| 2020 | 43 | 35 |
| 2021 | 25 | 39 |
| 2022 | 26 | 31 |
| 2023 | 28 | 30 |
| 2024 | 21 | 20 |
| 2025 | 20 | 13 |
| 2026 | 12 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Temperature measuring device for electrical contact element11 Aug 2026US 12,704,414 B2Lisa Dräxlmaier GmbH
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate9 Jun 2026US 12,653,078 B2Intel Corporation
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Circuit module, circuit board, electronic device, and package module10 Sep 2026US 2026/0271181 A1Lite-On Technology Corporation
- Power pin assembly structure of electronic device and manufacturing process for substrate thereof23 Jul 2026US 2026/0214797 A1MetaPWR Electronics Co., Ltd.
- Circuit board for receiving at least one contact pin, method for contacting a circuit board and circuit21 May 2026US 2026/0143590 A1Bizlink Industry Germany GmbH
- Socket contact30 Apr 2026US 2026/0121319 A1Saab AB
- Ceramic circuit board and method for manufacturing same19 Mar 2026US 2026/0082479 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Wiring substrate133US 9,818,681 B2Shinko Electric Industries Co., Ltd. · 2017
- Shared socket multi-chip module and/or piggyback pin grid array package118US 5,734,555 AIntel Corporation · 1998
- Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate101US 4,462,534 AInternational Business Machines Corporation · 1984
- Surface mount compatible connector system with mechanical integrity98US 4,641,426 AAssociated Enterprises, Inc. · 1987
- Method of forming an electrical contact96US 8,966,747 B2VLT, Inc. · 2015