H05K 2201/10295
Metallic connector elements partly mounted in a hole of the pcb
Official title: Metallic connector elements partly mounted in a hole of the PCB
H05K2201/10295 (Metallic connector elements partly mounted in a hole of the pcb) appears on 857 US grants and 791 published applications in this corpus.
Search patents in H05K- Granted patents
- 857
- Published applications
- 791
- Assignees
- 560
- Inventors
- 2,117
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 3 | 0 |
| 1978 | 8 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 8 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 6 | 0 |
| 1989 | 11 | 0 |
| 1990 | 8 | 0 |
| 1991 | 14 | 0 |
| 1992 | 12 | 0 |
| 1993 | 11 | 0 |
| 1994 | 12 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 13 | 0 |
| 2000 | 10 | 0 |
| 2001 | 9 | 2 |
| 2002 | 10 | 14 |
| 2003 | 11 | 13 |
| 2004 | 17 | 13 |
| 2005 | 13 | 18 |
| 2006 | 15 | 14 |
| 2007 | 12 | 19 |
| 2008 | 8 | 40 |
| 2009 | 13 | 40 |
| 2010 | 20 | 23 |
| 2011 | 32 | 30 |
| 2012 | 17 | 26 |
| 2013 | 24 | 42 |
| 2014 | 24 | 36 |
| 2015 | 29 | 36 |
| 2016 | 33 | 49 |
| 2017 | 46 | 38 |
| 2018 | 50 | 49 |
| 2019 | 47 | 45 |
| 2020 | 59 | 48 |
| 2021 | 33 | 50 |
| 2022 | 35 | 44 |
| 2023 | 36 | 37 |
| 2024 | 33 | 32 |
| 2025 | 29 | 16 |
| 2026 | 14 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Temperature measuring device for electrical contact element11 Aug 2026US 12,704,414 B2Lisa Dräxlmaier GmbH
- Systems and methods for a power electronics assembly of an imaging system4 Aug 2026US 12,701,681 B2GE Precision Healthcare LLC
- Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate9 Jun 2026US 12,653,078 B2Intel Corporation
- High current printed circuit board mount terminal for magnetic or leaded components5 May 2026US 12,620,735 B2BorgWarner US Technologies LLC
- Circuit module, circuit board, electronic device, and package module10 Sep 2026US 2026/0271181 A1Lite-On Technology Corporation
- Cleaner13 Aug 2026US 2026/0232159 A1LG Electronics Inc.
- Power modules13 Aug 2026US 2026/0240002 A1STMicroelectronics International N. V.
- Circuit board and method of manufacturing circuit board6 Aug 2026US 2026/0231327 A1Samsung Electro-Mechanics Co., Ltd.
- Power pin assembly structure of electronic device and manufacturing process for substrate thereof23 Jul 2026US 2026/0214797 A1MetaPWR Electronics Co., Ltd.
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Wiring substrate133US 9,818,681 B2Shinko Electric Industries Co., Ltd. · 2017
- Shared socket multi-chip module and/or piggyback pin grid array package118US 5,734,555 AIntel Corporation · 1998
- Multi-chip module connector element and system104US 5,167,512 A1992
- Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate101US 4,462,534 AInternational Business Machines Corporation · 1984