Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate

An assembly, comprising:

• a package comprising a package substrate, a die coupled to a top surface of the package substrate, and a dielectric layer located under the package substrate, the dielectric layer comprising a plurality of holes having a liquid metal (LM) therein;
• a printed circuit board (PCB) having a plurality of surface pins;
• the package located on the PCB, with individual surface pins of the plurality of surface pins inserted into respective holes in the package;
• and
• a magnet removably attached to an upper surface of the dielectric layer.

A system, comprising:

• a printed circuit board (PCB) having a plurality of surface pins arranged in a pinout;
• an integrated circuit component attached to the PCB;
• a package comprising a package substrate, a die coupled to a top surface of the package substrate, and a layer located under the package substrate, the layer comprising polyimide, wherein a plurality of holes are arranged in the pinout, the plurality of holes having a liquid metal therein;
• the package is attached at a lower surface of the layer to the PCB, such that individual surface pins of the plurality of surface pins are inserted into a respective hole in the package;
• and
• a magnet located on an upper surface of the layer and at least substantially surrounding a perimeter of the package substrate.

An apparatus comprising:

• a layer comprising polyimide, an upper surface, and a lower surface, the layer having a plurality of holes from the upper surface to the lower surface;
• individual holes of the plurality of holes having a liquid metal (LM) therein that extends from the lower surface to the upper surface;
• a package substrate including a backside adjacent to the upper surface of the layer;
• and
• an alignment means removably attached to the layer and located at a periphery of the package substrate, the alignment means configured to provide alignment reference in assembly.