H05K 2201/10234
Metallic balls
H05K2201/10234 (Metallic balls) appears on 252 US grants and 232 published applications in this corpus.
Search patents in H05K- Granted patents
- 252
- Published applications
- 232
- Assignees
- 144
- Inventors
- 680
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 13 | 4 |
| 2002 | 6 | 9 |
| 2003 | 8 | 20 |
| 2004 | 14 | 12 |
| 2005 | 14 | 15 |
| 2006 | 8 | 14 |
| 2007 | 13 | 11 |
| 2008 | 6 | 14 |
| 2009 | 4 | 16 |
| 2010 | 10 | 12 |
| 2011 | 9 | 6 |
| 2012 | 6 | 3 |
| 2013 | 6 | 0 |
| 2014 | 1 | 8 |
| 2015 | 5 | 13 |
| 2016 | 8 | 3 |
| 2017 | 7 | 7 |
| 2018 | 4 | 5 |
| 2019 | 5 | 10 |
| 2020 | 4 | 7 |
| 2021 | 5 | 9 |
| 2022 | 4 | 6 |
| 2023 | 7 | 6 |
| 2024 | 4 | 9 |
| 2025 | 4 | 6 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package28 Jul 2026US 12,696,775 B2Samsung Electronics Co., Ltd.
- Wiring board3 Mar 2026US 12,568,584 B2Murata Manufacturing Co., Ltd.
- Interconnect substrate including substrates and connector disposed in recess21 Oct 2025US 12,451,631 B2Shinko Electric Industries Co., Ltd.
- Circuit module26 Aug 2025US 12,401,142 B2Murata Manufacturing Co., Ltd.
- Ceramic electronic component, substrate arrangement, and method of manufacturing ceramic electronic component14 Jan 2025US 12,198,859 B2Taiyo Yuden Co., Ltd.
- Printed wiring board and method for manufacturing the same3 Sep 2026US 2026/0262163 A1Ibiden Co., Ltd.
- Wiring board and method of manufacturing wiring board27 Aug 2026US 2026/0255491 A1Shinko Electric Industries Co., Ltd.
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
- Circuit board for connectors18 Jun 2026US 2026/0173254 A1Min Di Consultants Ltd.
- Wiring substrate12 Feb 2026US 2026/0047010 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Method for connecting packages of a stacked ball grid array structure229US 5,783,870 ANational Semiconductor Corporation · 1998
- Thin stacked integrated circuit device208US 6,137,164 ATexas Instruments Incorporated · 2000
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994
- Microelectronic component with rigid interposer172US 6,002,168 ATessera, Inc. · 1999