Circuit module

A circuit module comprising:

• an upper circuit board;
• a lower circuit board;
• a first conductor member;
• a second conductor member;
• a first component, and
• a sealing resin,
• wherein
• the upper circuit board has a first upper main surface and a first lower main surface,
• the lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in a downward direction of an up-down axis,
• the first component is mounted on the first lower main surface or the second upper main surface,
• the first conductor member is a metal pin or a solder bump, and is connected to the first lower main surface,
• the second conductor member is a metal pin and is connected to the second upper main surface,
• the second conductor member is electrically connected to the first conductor member,
• a length of the second conductor member in an up-down direction is longer than a maximum value of a length of the second conductor member in an orthogonal direction orthogonal to the up-down direction, wherein the up-down direction extends along the up-down axis, and
• the sealing resin covers the first lower main surface and the second upper main surface.