US 6,002,168 AGranted

Microelectronic component with rigid interposer

AssigneeTessera, Inc.

InventorsPieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, Christopher M. Pickett, John W. Smith

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Abstract

A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

Claims48

Dependent claims

A microelectronic component, comprising

A. A first interposer having a first surface, a second surface and a plurality of contacts disposed in a pattern on said second surface, said pattern encompassing a contact pattern area on said second surface, wherein said first interposer is configured such that a semiconductor chip is mountable thereon and electrically connectable thereto;
B. a second interposer overlying the second surface of said first interposer, said second interposer having a top surface facing toward the second surface of said first interposer and a bottom surface, said second interposer being more flexible than said first interposer;
C. a plurality of terminals disposed in a pattern on at least one of said top and bottom surfaces of said second interposer;
D. a plurality of electrical connections connecting said terminals on said second interposer to said contacts on said first interposer, said terminals being moveable relative to said contacts so as to compensate for thermal expansion of said first interposer;
and
E. a plurality of joining units disposed in a pattern corresponding to the pattern of terminals, each of said joining units being associated with, and electrically connected to, one of said terminals on said second interposer and each of said joining units comprising a solid core.

3 more elements

A microelectronic component, comprising

A. A first interposer having a first surface, a second surface and a plurality of contacts disposed in a pattern on said second surface, said pattern encompassing a contact pattern area on said second surface, wherein said first interposer is configured such that a semiconductor chip is mountable thereon and electrically connectable thereto;
B. a second interposer overlying the second surface of said first interposer, said second interposer having a top surface facing toward the second surface of said first interposer and a bottom surface, said second interposer being more flexible than said first interposer;
C. a plurality of terminals disposed in a pattern on at least one of said top and bottom surfaces of said second interposer;
D. a plurality of electrical connections connecting said terminals on said second interposer to said contacts on said first interposer, said terminals being moveable relative to said contacts so as to compensate for thermal expansion of said first interposer;
E. a plurality of joining units disposed in a pattern corresponding to the pattern of terminals, each of said joining units being associated with, and electrically connected to, one of said terminals on said second interposer;
and
F. a compliant layer disposed between the first interposer and the second interposer at least partially covering said plurality of electrical connection;
and wherein the first interposer is alumina, the second interposer is a thin, flexible sheet of polyimide and has at least one aperture extending from the top surface to the bottom surface, each of said plurality of electrical connections includes an S-shaped flexible lead extending between one said terminal on said second interposer and one said contact on said first interposer.

5 more elements

A microelectronic component, comprising

A. A first interposer having a first surface, a second surface and a plurality of contacts disposed in a pattern on said second surface, said pattern encompassing a contact pattern area on said second surface, wherein said first interposer is configured such that a semiconductor chip is mountable thereon and electrically connectable thereto;
B. a second interposer overlying the second surface of said first interposer, said second interposer having a top surface facing toward the second surface of said first interposer and a bottom surface, said second interposer being more flexible than said first interposer;
C. a plurality of terminals disposed in a pattern on at least one of said top and bottom surfaces of said second interposer;
D. a plurality of electrical connections connecting said terminals on said second interposer to said contacts on said first interposer, said terminals being moveable relative to said contacts so as to compensate for thermal expansion of said first interposer;
E. a plurality of joining units disposed in a pattern corresponding to the pattern of terminals, each of said joining units being associated with, and electrically connected to, one of said terminals on said second interposer;
F. a semiconductor chip physically mounted on, and electrically interconnected to, the first surface of said first interposer;
and
G. a compliant layer disposed between the first interposer and the second interposer and at least partially covering said plurality of electrical connections.

5 more elements

A microelectronic component, comprising

A. A first interposer having a first surface, a second surface and a plurality of contacts disposed in a pattern on said second surface, said pattern encompassing a contact pattern area on said second surface, wherein said first interposer is configured such that a semiconductor chip is mountable thereon and electrically connectable thereto;
B. a second interposer overlying the second surface of said first interposer, said second interposer having a top surface facing toward the second surface of said first interposer and a bottom surface, said second interposer being more flexible than said first interposer;
C. a plurality of terminals disposed in a pattern on at least one of said top and bottom surfaces of said second interposer;
D. a plurality of electrical connections connecting said terminals on said second interposer to said contacts on said first interposer, said terminals being moveable relative to said contacts so as to compensate for thermal expansion of said first interposer;
E. a plurality of joining units disposed in a pattern corresponding to the pattern of terminals, each of said joining units being associated with, and electrically connected to, one of said terminals on said second interposer;
F. a semiconductor chip physically mounted on, and electrically interconnected to, the first surface of said first interposer;
and
G. a compliant layer disposed between the first interposer and the second interposer and at least partially covering said plurality of electrical connections;
and wherein the first interposer is alumina, the second interposer is a thin, flexible sheet of polyimide and has at least one aperture extending from the top surface to the bottom surface, each of said plurality of electrical connections includes an S-shaped flexible lead extending between one said terminal on said second interposer and one said contact on said first interposer.

6 more elements

Dependencies are inferred from the claim text.