Wiring board
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshiki Tobita, Issei Yamamoto
Life of this patent
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Abstract
To provide wiring board capable of reducing influence of variation in size of conductive member on coil conductor. Wiring board according to present disclosure includes insulating layer, plurality of land electrodes formed on lower surface of insulating layer, solder ball formed on surface of at least one of plurality of land electrodes, and coil conductor provided inside insulating layer and having winding axis intersecting lower surface. Plurality of land electrodes includes electrode at a position overlapped opening of coil conductor in plan view seen at the wiring board from lower surface side, and second electrode at a position deviated from opening of coil conductor in plan view. Area of first electrode is larger than area of second electrode in plan view.
Claims20
A wiring board comprising:
- at least one insulating layer having a first surface and a second surface opposite to the first surface;
- a plurality of land electrodes formed on the first surface of the insulating layer;
- a conductive member formed on a surface of at least one of the plurality of land electrodes;
- and
- a coil conductor provided inside the insulating layer or on the second surface of the insulating layer and having a winding axis intersecting the first surface, wherein
- the plurality of land electrodes comprise:
- at least one first electrode located at a position where at least a part of the first electrode overlaps an opening of the coil conductor in plan view seen from a first surface side;
- and
- a second electrode located at a position deviated from the opening of the coil conductor in plan view seen from the first surface side, and wherein
- an area of the first electrode is larger than an area of the second electrode in plan view seen from the first surface side.
Dependencies are inferred from the claim text.