H05K 2201/10015
Non-printed capacitor
H05K2201/10015 (Non-printed capacitor) appears on 1,746 US grants and 2,137 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,746
- Published applications
- 2,137
- Assignees
- 612
- Inventors
- 3,693
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 2 |
| 2002 | 4 | 5 |
| 2003 | 6 | 3 |
| 2004 | 4 | 8 |
| 2005 | 5 | 8 |
| 2006 | 8 | 9 |
| 2007 | 5 | 15 |
| 2008 | 6 | 23 |
| 2009 | 8 | 25 |
| 2010 | 21 | 19 |
| 2011 | 13 | 19 |
| 2012 | 17 | 38 |
| 2013 | 16 | 37 |
| 2014 | 27 | 92 |
| 2015 | 53 | 168 |
| 2016 | 113 | 149 |
| 2017 | 147 | 174 |
| 2018 | 145 | 205 |
| 2019 | 209 | 198 |
| 2020 | 194 | 158 |
| 2021 | 137 | 149 |
| 2022 | 132 | 137 |
| 2023 | 122 | 127 |
| 2024 | 90 | 144 |
| 2025 | 117 | 120 |
| 2026 | 82 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Multilayer electronic component and board having the same mounted thereon1 Oct 2026US 2026/0302072 A1Samsung Electro-Mechanics Co., Ltd.
- Multiphase power module with paired power stages and embedded inductors1 Oct 2026US 2026/0304628 A1Quanta Computer Inc.
- Stacked capacitor packaging structure and method of manufacturing the same, and an electronic device24 Sep 2026US 2026/0290695 A1AiPAQ Technology CO., LTD
Most cited
By later US patents
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- High speed discrete wire pin panel assembly with embedded capacitors130US 4,878,155 A1989
- Apparatus and method for flat circuit assembly128US 5,600,175 ATexas Instruments Incorporated · 1997
- Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder124US 5,729,896 AInternational Business Machines Corporation · 1998
- Modular jack121US 5,069,641 AMurata Manufacturing Co., Ltd. · 1991