Stacked capacitor packaging structure and method of manufacturing the same, and an electronic device

An electronic device, comprising:

• a circuit substrate structure having at least one positive pad and at least one negative pad;
• and
• a stacked capacitor packaging structure disposed on the circuit substrate structure and electrically connected to the circuit substrate structure;
• wherein the stacked capacitor packaging structure includes a capacitor unit, an insulating package body and a terminal electrode structure;
• wherein the capacitor unit includes a plurality of capacitor elements stacked in sequence and electrically connected to each other, the insulating package body is configured to partially enclose the capacitor elements, and the terminal electrode structure includes a first electrode structure layer for covering a first side portion of the insulating package body, and a second electrode structure layer for covering a second side portion of the insulating package body;
• wherein each of the capacitor elements has a positive electrode portion and a negative electrode portion, the positive electrode portions of the capacitor elements are separate from each other by a predetermined distance, and the negative electrode portions of the capacitor elements are stacked in sequence to provide a lateral common negative electrode structure;
• wherein a positive side surface of the positive electrode portion of each of the capacitor elements is exposed by the first side portion of the insulating package body, thereby being directly electrically connected to the first electrode structure layer;
• and
• wherein at least one negative side surface of the lateral common negative electrode structure that is provided by the negative electrode portions stacked in sequence is exposed by the second side portion of the insulating package body, thereby being directly electrically connected to the second electrode structure layer.

A method of manufacturing a stacked capacitor packaging structure, comprising processes of:

• stacking a plurality of capacitor elements in sequence, wherein each of the capacitor elements has a positive electrode portion, a negative electrode portion, and a temporary carrier portion extending from the positive electrode portion, and the negative electrode portions of the capacitor elements are stacked in sequence to provide a lateral common negative electrode structure;
• forming an insulating package body to partially enclose the capacitor elements, wherein at least one negative side surface of the lateral common negative electrode structure that is provided by the negative electrode portions stacked in sequence is exposed by a second side portion of the insulating package body, and the temporary carrier portion of each of the capacitor elements is exposed from the insulating package body;
• forming a first side electrode material on the insulating package body;
• removing the temporary carrier portion of each of the capacitor elements to expose a positive side surface of the positive electrode portion of each of the capacitor elements from a first side portion of the insulating package body;
• and
• forming a second side electrode material on the insulating package body;
• wherein the first side electrode material and the second side electrode material are configured to cooperate with each other to form a terminal electrode structure, and the terminal electrode structure includes a first electrode structure layer and a second electrode structure layer;
• wherein the first electrode structure layer of the terminal electrode structure is configured to enclose the first side portion of the insulating package body and directly electrically connect to the positive side surface of the positive electrode portion of each of the capacitor elements;
• and
• wherein the second electrode structure layer of the terminal electrode structure is configured to enclose the second side portion of the insulating package body and directly electrically connect to the at least one negative side surface of the lateral common negative electrode structure.