Multilayer electronic component and board having the same mounted thereon
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSoo Hwan SON, Se Hun PARK, Yeong Lim KWON
Life of this patent
Estimating the term…
Abstract
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; an external electrode disposed on the body; and a coating layer disposed on the first and second surfaces, and when an average thickness of a coating layer disposed on the first surface, among the coating layer, is referred to as TCL1 and an average thickness of a remaining coating layer excluding the coating layer disposed on the first surface is referred to as TCL2, TCL2<TCL1 and 2 μm≤TCL2≤6 μm may be satisfied.
Claims17
A multilayer electronic component, comprising:
- a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction, the body including first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction;
- an external electrode disposed on the body;
- and
- a coating layer disposed on the first and second surfaces, the coating layer including a first portion disposed on the first surface, and a second portion that is free of the first portion,
- wherein, when an average thickness of the first portion is referred to as TCL1 and an average thickness of the second portion is referred to as TCL2, TCL2<TCL1 and 2 μm≤TCL2≤6 μm are satisfied.
A board having a multilayer electronic component mounted thereon, comprising:
- a substrate;
- an electrode pad disposed on the substrate;
- a multilayer electronic component including a body having a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction, the body including first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction, an external electrode disposed on the body, and a coating layer disposed on the first and second surfaces, the coating layer including a first portion disposed on the first surface, and a second portion that is free of the first portion;
- and
- a solder connecting the external electrode and the electrode pads,
- wherein, when an average thickness of the first portion is referred to as TCL1 and an average thickness of the second portion is referred to as TCL2, TCL2<TCL1 and 2 μm≤TCL2≤6 μm are satisfied.
Dependencies are inferred from the claim text.