H05K 2201/09554
Via connected to metal substrate
H05K2201/09554 (Via connected to metal substrate) appears on 220 US grants and 182 published applications in this corpus.
Search patents in H05K- Granted patents
- 220
- Published applications
- 182
- Assignees
- 102
- Inventors
- 420
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 15 | 10 |
| 2002 | 14 | 14 |
| 2003 | 11 | 18 |
| 2004 | 24 | 18 |
| 2005 | 13 | 17 |
| 2006 | 15 | 9 |
| 2007 | 11 | 11 |
| 2008 | 9 | 22 |
| 2009 | 8 | 17 |
| 2010 | 11 | 10 |
| 2011 | 15 | 2 |
| 2012 | 12 | 3 |
| 2013 | 8 | 2 |
| 2014 | 3 | 1 |
| 2015 | 4 | 3 |
| 2016 | 1 | 4 |
| 2017 | 2 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 2 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 2 |
| 2023 | 2 | 4 |
| 2024 | 2 | 4 |
| 2025 | 1 | 3 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Single layer capacitor7 Apr 2026US 12,597,567 B2KYOCERA AVX Components Corporation
- Wiring circuit board7 Apr 2026US 12,598,703 B2Nitto Denko Corporation
- Wiring circuit board25 Feb 2025US 12,238,858 B2Nitto Denko Corporation
- Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same31 Dec 2024US 12,185,456 B2First Hi-tec Enterprise Co.,Ltd.
- Single Layer Capacitor23 Jul 2026US 2026/0213080 A1KYOCERA AVX Components Corporation
- Led module having through channels and conforming to certification standards of dci and display screen18 Jun 2026US 2026/0173590 A1Nanjing Lopu Co., Ltd.
- Bottom-up through glass via plating for glass core28 May 2026US 2026/0150195 A1Intel Corporation
- Printed wiring board17 Apr 2025US 2025/0126709 A1Ibiden Co., Ltd.
- Plated through-hole structures and method for the manufacture thereof3 Apr 2025US 2025/0113446 A1
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005
- Two signal one power plane circuit board145US 6,204,453 B1International Business Machines Corporation · 2001
- Process for thin film interconnect112US 5,231,751 AInternational Business Machines Corporation · 1993