Single layer capacitor
AssigneeKYOCERA AVX Components Corporation
InventorsRonald S. Demcko, Cory Nelson, Marianne Berolini, Jeff Borgman
Life of this patent
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Abstract
A single layer capacitor can include a substrate having a first surface and a second surface opposite the first surface. A resistive layer can be formed over at least a portion of the first surface of the substrate. A first conductive layer can be formed over at least a portion of the resistive layer. A second conductive layer can be formed over at least a portion of the second surface of the substrate. As such, the single layer capacitor can include a resistor and a capacitor formed in series with one another.
Claims20
A single layer capacitor comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- a resistive layer formed over at least a first portion of the first surface of the substrate;
- a first conductive layer formed over at least a portion of the resistive layer;
- a first terminal formed over at least a portion of the first conductive layer;
- and
- a second conductive layer formed over at least a portion of the second surface of the substrate.
A method for forming a single layer capacitor, the method comprising:
- depositing a resistive layer over at least a first portion of a first surface of a substrate;
- depositing a first conductive layer over at least a portion of the resistive layer;
- depositing a first terminal such that the first terminal is formed over the first conductive layer;
- and
- depositing a second conductive layer over at least a portion of a second surface of the substrate, the second surface opposite the first surface.
An embedded capacitor assembly comprising:
- a circuit board substrate having a mounting surface;
- and
- a single layer capacitor at least partially embedded within the circuit board substrate, the single layer capacitor comprising:
- a substrate having a first surface opposite a second surface,
- a resistive layer formed over at least a first portion of the first surface,
- a first conductive layer formed over at least a portion of the resistive layer,
- a first terminal formed over at least a portion of the first conductive layer, and
- a second conductive layer formed over at least a portion of the second surface.
Dependencies are inferred from the claim text.