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US 12,238,858 B2Granted
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsShusaku Shibata, Teppei Niino, Yosuke Nakanishi
Life of this patent
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Abstract
Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.
Claims7
A wiring circuit board comprising:
- a first insulating layer consisting of resin;
- a conductive pattern disposed on the first insulating layer, the conductive pattern having a first terminal, a second terminal, and a wire that electrically connects the first terminal and the second terminal;
- a protective layer disposed between the first insulating layer and the conductive pattern and protecting the conductive pattern;
- and
- a second insulating layer disposed on the first insulating layer and covering the wire without covering at least a part of the first terminal and at least a part of the second terminal,
- wherein the protective layer consists of a metal oxide.
3 more elements
Dependencies are inferred from the claim text.