H05K 2201/0715
Provided by an outer layer of pcb
Official title: provided by an outer layer of PCB
H05K2201/0715 (Provided by an outer layer of pcb) appears on 983 US grants and 919 published applications in this corpus.
Search patents in H05K- Granted patents
- 983
- Published applications
- 919
- Assignees
- 445
- Inventors
- 2,123
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 10 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 9 | 0 |
| 1991 | 16 | 0 |
| 1992 | 11 | 0 |
| 1993 | 12 | 0 |
| 1994 | 28 | 0 |
| 1995 | 13 | 0 |
| 1996 | 15 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 15 | 0 |
| 2000 | 5 | 0 |
| 2001 | 15 | 7 |
| 2002 | 19 | 18 |
| 2003 | 20 | 24 |
| 2004 | 22 | 28 |
| 2005 | 22 | 28 |
| 2006 | 24 | 31 |
| 2007 | 17 | 25 |
| 2008 | 27 | 38 |
| 2009 | 12 | 37 |
| 2010 | 20 | 40 |
| 2011 | 29 | 33 |
| 2012 | 28 | 42 |
| 2013 | 24 | 42 |
| 2014 | 39 | 37 |
| 2015 | 40 | 57 |
| 2016 | 32 | 36 |
| 2017 | 40 | 34 |
| 2018 | 41 | 45 |
| 2019 | 43 | 39 |
| 2020 | 57 | 57 |
| 2021 | 31 | 41 |
| 2022 | 46 | 42 |
| 2023 | 34 | 63 |
| 2024 | 39 | 39 |
| 2025 | 53 | 26 |
| 2026 | 17 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Mechanical mitigation of neutron see22 Sep 2026US 12,745,644 B2Rockwell Collins, Inc.
- Shielding structure and circuit board15 Sep 2026US 12,739,966 B2Zte Corporation
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Flexible circuit assembly and cover for traction inverter system for an electric vehicle30 Jun 2026US 12,672,250 B2Rivian IP Holdings, LLC
- Electronic device10 Sep 2026US 2026/0267189 A1Innolux Corporation
- Component Carrier With Components Shielded by Vertical Partitioning Structures Disconnected in a Shielding Region16 Jul 2026US 2026/0206600 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Multilayered flexible printed circuit board and electronic device comprising same18 Jun 2026US 2026/0173252 A1Samsung Electronics Co., Ltd.
- Foldable electronic device28 May 2026US 2026/0147389 A1Samsung Electronics Co., Ltd.
- Hearing aid with hearing aid module, and hearing aid module and method for manufacturing the same23 Apr 2026US 2026/0113580 A1Sivantos Pte.Ltd
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991