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US 12,745,644 B2Granted
Mechanical mitigation of neutron see
AssigneeRockwell Collins, Inc.
InventorsEric N. Anderson, Timothy R. Fannin, Brent J Nelson, Matthew P. Corbett
Life of this patent
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Abstract
Neutron single effect events are mitigated using gadolinium. Layers of gadolinium are fully encapsulated as part of an airborne electronic hardware, in circuit boards, in heat sinks, and as part of the device packaging. The gadolinium layers are designed to shield semiconductor chips from neutrons. Shielding the semiconductor chips from the neutrons reduces the upset rate of device packages using the semiconductor ships.
Claims20
An airborne electronic hardware comprising:
- a device package;
- a printed circuit board comprising:
- a substrate;
- a conductive layer;
- wherein the conductive layer is formed on the substrate;
- wherein the device package is electrically coupled to the conductive layer;
- and
- a gadolinium layer (132);
- wherein the gadolinium layer (132) is over a bottom surface of the substrate;
- wherein the device package is disposed above the gadolinium layer (132);
- wherein the gadolinium layer (132) extends wider than the device package;
- and
- a heat sink comprising:
- a base;
- wherein the heat sink is coupled to the device package at the base;
- a plurality of fins;
- wherein the plurality of fins extend upwards from the base;
- and
- a gadolinium layer (114);
- wherein the base encapsulates the gadolinium layer (114);
- wherein the gadolinium layer (114) is disposed above the device package.
18 more elements
An airborne electronic hardware comprising:
- a device package;
- a printed circuit board comprising:
- a substrate;
- a conductive layer;
- wherein the conductive layer is formed on the substrate;
- wherein the device package is electrically coupled to the conductive layer;
- and
- a gadolinium layer (120);
- wherein the substrate encapsulates the gadolinium layer (120);
- wherein the device package is disposed above the gadolinium layer (120);
- wherein the gadolinium layer (120) extends wider than the device package;
- and
- a heat sink comprising:
- a base;
- wherein the heat sink is coupled to the device package at the base;
- a plurality of fins;
- wherein the plurality of fins extend upwards from the base;
- and
- a gadolinium layer (114);
- wherein the base encapsulates the gadolinium layer (114);
- wherein the gadolinium layer (114) is disposed above the device package.
18 more elements
A device package comprising:
- a semiconductor chip;
- a substrate;
- a gadolinium layer (224);
- wherein the substrate encapsulates the gadolinium layer (224);
- wherein the gadolinium layer (224) is disposed below the semiconductor chip;
- and
- a molding compound;
- wherein the molding compound is formed over and onto the semiconductor chip.
5 more elements
Dependencies are inferred from the claim text.