H05K 13/0812
The monitoring devices being integrated in the mounting machine
Official title: {the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement}
H05K13/0812 (The monitoring devices being integrated in the mounting machine) appears on 562 US grants and 512 published applications in this corpus.
Search patents in H05K- Granted patents
- 562
- Published applications
- 512
- Assignees
- 169
- Inventors
- 933
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 11 | 0 |
| 1994 | 5 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 6 | 0 |
| 1998 | 13 | 0 |
| 1999 | 18 | 0 |
| 2000 | 17 | 0 |
| 2001 | 15 | 7 |
| 2002 | 21 | 21 |
| 2003 | 17 | 9 |
| 2004 | 11 | 16 |
| 2005 | 10 | 24 |
| 2006 | 15 | 12 |
| 2007 | 14 | 16 |
| 2008 | 7 | 8 |
| 2009 | 14 | 12 |
| 2010 | 9 | 15 |
| 2011 | 5 | 6 |
| 2012 | 9 | 14 |
| 2013 | 9 | 20 |
| 2014 | 13 | 20 |
| 2015 | 11 | 22 |
| 2016 | 12 | 15 |
| 2017 | 15 | 16 |
| 2018 | 16 | 20 |
| 2019 | 23 | 50 |
| 2020 | 35 | 59 |
| 2021 | 44 | 21 |
| 2022 | 50 | 40 |
| 2023 | 19 | 24 |
| 2024 | 26 | 26 |
| 2025 | 21 | 7 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- IC chip-mounting device and IC chip-mounting method26 May 2026US 12,641,766 B2Kabushiki Kaisha Sato
- Mapping device including electrostatic chuck and anti- separation frame17 Mar 2026US 12,581,632 B2Samsung Display Co., Ltd.
- Apparatus for producing semiconductor device, and method for producing semiconductor device10 Mar 2026US 12,575,368 B2Yamaha Robotics Co., Ltd.
- Component mounter and component mounting method3 Sep 2026US 2026/0262207 A1Fuji Corporation
- Method and apparatus for determining a positioning error of a pickable component27 Aug 2026US 2026/0255919 A1
- Real-time pcba monitoring and alert system30 Jul 2026US 2026/0223345 A1
- Mapping device and mapping method using the same16 Jul 2026US 2026/0206197 A1Samsung Display Co., Ltd.
- Component mounting apparatus and determination method25 Jun 2026US 2026/0181848 A1Fuji Corporation
Most cited
By later US patents
- Multiple image camera for measuring the alignment of objects in different planes107US 5,883,663 A1999
- Apparatus and method for determining the position of a component prior to placement97US 5,559,727 AQuad Systems Corporation · 1996
- Electric-component mounting system92US 6,739,036 B2Fuji Machine Mfg. Co., Ltd. · 2004
- High precision component alignment sensor system80US 5,278,634 ACyberOptics Corporation · 1994
- Method for mounting components and an apparatus therefor65US 5,377,405 AYamaha Hatsudoki Kabushiki Kaisha · 1995